Page 11 - PCB-West-2020-Catalog
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OVERVIEW OF PCB WEST 2020 TECHNICAL CONFERENCE BY SUBJECT
£Advanced
Naveid Rahmatullah, Intel, and Xiao Ming Gao, Intel
£Beginner £ Intermediate ARTIFICIAL INTELLIGENCE
Accelerate PCB Platforms Layout Design Using AI Smart Router
ASSEMBLY PROCESSES
Bringing Electronics Innovations to Market Faster with a Software- Based PCBA Manufacturing Model
The PCB Design Process from Cradle to Grave
Design-for-Manufacture and Design-for-Assembly Fundamentals that Decrease Holds and Lower the Cost of Manufacturing
The Current State of Fabrication and Assembly – Dispelling Myths, Correcting Misunderstandings, and Explaining Mysteries
From Smart Factory Automation to Digital Twin Standard: Ushering a New Era for Design and Manufacturing
PCB Problem Solving – PCB 102 Heterogeneous OR Mixed-Up Assembly
PCB Design and Assembly Process Strategy for High Density CSP, WLP, 2D and 3D Semiconductor Package Technology
Flexible and Rigid Flex Circuits: Design, Fabrication and Assembly Process Principles
BUSINESS/MARKETS
Heterogeneous OR Mixed-Up Assembly
Design-for-Manufacture and Design-for-Assembly Fundamentals that Decrease Holds and Lower the Cost of Manufacturing
From Smart Factory Automation to Digital Twin Standard: Ushering a New Era for Design and Manufacturing
COMPONENTS/PACKAGING
The PCB Design Process from Cradle to Grave Heterogeneous OR Mixed-Up Assembly
PCB Design and Assembly Process Strategy for High Density CSP, WLP, 2D and 3D Semiconductor Package Technology
Embedded Capacitance Technology Concept: Design, Implementation, and Processing Guidelines
The Current State of Fabrication and Assembly – Dispelling Myths, Correcting Misunderstandings, and Explaining Mysteries
Hair-Raising Footprint Horror Stories – and How to Avoid Them
Design and Implementation of Copper Coin Application Over Thermal VIA (Vertical Interconnect Access) Structure for Thermal Management up to 12W Device Application
PC Board Design of Power Distribution and Decoupling The Mystery of Bypass Capacitors
Design-for-Manufacture and Design-for-Assembly Fundamentals that Decrease Holds and Lower the Cost of Manufacturing
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Dan Radler, Tempo Automation
Daniel J. Smith, Raytheon SAS
Mark J. Hughes, Royal Circuit Solutions and Elijah Gracia, Royal Circuit Solutions
Shane Shuffield, Advanced Assembly, and Mark Hughes, Advanced Assembly
Michael Ford, Aegis Software, and Hemant Shah, Cadence
Paul Cooke, AGC-Nelco Taconic
Phil Marcoux, PPM Associates
Vern Solberg, Solberg Technical Consulting
Vern Solberg, Solberg Technical Consulting
Phil Marcoux, PPM Associates
Mark J. Hughes, Royal Circuit Solutions and Elijah Gracia, Royal Circuit Solutions
Michael Ford, Aegis Software, and Hemant Shah, Cadence
Daniel J. Smith, Raytheon SAS
Phil Marcoux, PPM Associates
Vern Solberg, Solberg Technical Consulting
Robert Carter, Oak-Mitsui Technologies, and Benjamin Jordan, Altium
Shane Shuffield, Advanced Assembly, and Mark Hughes, Advanced Assembly
Elizabeth Bustamante, SnapEDA
Marcus Miguel V. Vicedo, Analog Devices, and Richard Legaspino, Analog Devices
Rick Hartley, RHartley Enterprises
Keven Coates, Geospace Technologies
Mark J. Hughes, Royal Circuit Solutions, and Elijah Gracia, Royal Circuit Solutions
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