Page 13 - PCB-West-2020-Catalog

OVERVIEW OF PCB WEST 2020 TECHNICAL CONFERENCE BY SUBJECT
£Beginner £ Intermediate £Advanced
EMI/EMC
Electromagnetic Fields for Normal Folks: Show Me the Pictures and Daniel Beeker, NXP Semiconductor Hold the Equations, Please!
£££
PCB Design Techniques to Improve ESD Robustness Daniel Beeker, NXP Semiconductor
£££
Novel Power Distribution System Design Daniel Beeker, NXP Semiconductor
Embedded Capacitance Technology Concept: Design, Robert Carter, Oak-Mitsui Technologies, and Benjamin Implementation, and Processing Guidelines Jordan, Altium
£££
Differential Pair Routing for SI and EMI Control Rick Hartley, RHartley Enterprises
££
Mechanical Design to Control EMI Rick Hartley, RHartley Enterprises
££
Circuit Grounding to Control Noise and EMI Rick Hartley, RHartley Enterprises
£
IoT PC Board Design and Layout Rick Hartley, RHartley Enterprises
££
PC Board Design of Power Distribution and Decoupling Rick Hartley, RHartley Enterprises
££
RF and Mixed Signal PCB Layout Rick Hartley, RHartley Enterprises
£
From DC to AC – Power Integrity and Decoupling Primer for PCB Ralf Bruening, Zuken Designers
£££
Power Delivery System Design Lee Ritchey, Speeding Edge
£££
Printed Circuit Board Stackup Design for High-Performance Lee Ritchey, Speeding Edge Products
£££
Feeding the Beast: Consumption-Based PCB design Daniel Beeker, NXP Semiconductor
The Mystery of Bypass Capacitors Keven Coates, Geospace Technologies
£££
An Intuitive Approach to Understanding Basic High-Speed Layout Keven Coates, Geospace Technologies
£
How to Fight Magnetic Noise Gremlins Keven Coates, Geospace Technologies
£££
Next-Generation Materials: High-Speed, RF and HDI Designs Michael R. Creeden, CID+, Insulectro
£££
Place and Route for Dense High-Speed and RF Circuits Michael R. Creeden, CID+, Insulectro
£££
FABRICATION PROCESSES/HDI
Power Delivery System Design
Lee Ritchey, Speeding Edge
£££
Printed Circuit Board Stackup Design for High-Performance Products
Lee Ritchey, Speeding Edge
£££
PCB Stackup Design and Materials Selection
Bill Hargin, Z-zero
££
The PCB Design Process from Cradle to Grave
Daniel J. Smith, Raytheon SAS
££
Heterogeneous OR Mixed-Up Assembly
Phil Marcoux, PPM Associates
££
Design and Implementation of Copper Coin Application Over Thermal VIA (Vertical Interconnect Access) Structure for Thermal Management up to 12W Device Application
Marcus Miguel V. Vicedo, Analog Devices, and Richard Legaspino, Analog Devices
£
Embedded Capacitance Technology Concept: Design, Implementation, and Processing Guidelines
Robert Carter, Oak-Mitsui Technologies, and Benjamin Jordan, Altium
£££
Fundamentals of Geometric Dimensioning and Tolerancing (GD&T) for the PWB Designer
Gary Ferrari, FTG
££
The Current State of Fabrication and Assembly – Dispelling Myths, Correcting Misunderstandings, and Explaining Mysteries
Shane Shuffield, Advanced Assembly, and Mark Hughes, Advanced
££
10