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Explore DYCONEX’ advanced solutions in interconnect technology for high-reliability applications at booth# 207
• HDI and ultra-HDI/microvia PCBs
• Flex and rigid-flex substrates for 3D miniaturization
• LCP substrates for biocompatible and HF applications
• Advanced packaging substrates
• Comprehensive inspection and test concepts
• ISO 9001, ISO 13485 and EN 9100 certified
www.mst.com/dyconex
DYCONEX AG
Grindelstrasse 40, CH-8303 Bassersdorf, Switzerland
Phone +41 43 266 11 00, mail.dyconex@mst.com, www.mst.com/dyconex
Sales office USA:
Micro Systems Technologies, Inc., 6024 SW Jean Road, Lake Oswego, OR 97035 Phone +1 (503) 744 8500, sales.msti@mst.com, www.mst.com
MST Group. Active around the globe, the Micro Systems Technologies (MST) Group consists of four technology companies with more than 1100 employees in three countries: DYCONEX AG, Switzerland | Litronik Batterietechnologie GmbH, Germany | Micro Systems Engineering GmbH, Germany | Micro Systems Engineering, Inc., USA
