Page 15 - PCB-West-2020-Catalog

OVERVIEW OF PCB WEST 2020 TECHNICAL CONFERENCE BY SUBJECT
£Beginner £ Intermediate £Advanced
FABRICATION PROCESSES/HDI - CONT.
Flexible Circuits: Design Through Test with Lessons Learned
Mark Finstad, Flexible Circuit Technologies, and Nick Koop, TTM Technologies
££
Flexible and Rigid Flex Circuits: Design, Fabrication and Assembly Process Principles
Vern Solberg, Solberg Technical Consulting
££
Design-for-Manufacture and Design-for-Assembly Fundamentals that Decrease Holds and Lower the Cost of Manufacturing
Mark J. Hughes, Royal Circuit Solutions, and Elijah Gracia, Royal Circuit Solutions
££
PCB Design and Assembly Process Strategy for High Density CSP, WLP, 2D and 3D Semiconductor Package Technology
Vern Solberg, Solberg Technical Consulting
£££
Semi-Additive PCB Processing Resets the Technology Curve
Mike Vinson, Averatek, and Kelly Dack, KeyTronic
£££
Next-Generation Materials: High-Speed, RF and HDI Designs
Michael R. Creeden, CID+, Insulectro
£££
Place and Route for Dense High-Speed and RF Circuits
Michael R. Creeden, CID+, Insulectro
£££
The Basics of PCB Fabrication (101)
Paul Cooke, AGC Nelco – Taconic
££
PCB Problem Solving – PCB 102
Paul Cooke, AGC-Nelco Taconic
££
FLEX CIRCUITS
Flexible Circuits: Design Through Test with Lessons Learned
Mark Finstad, Flexible Circuit Technologies, and Nick Koop, TTM Technologies
££
Flexible and Rigid Flex Circuits: Design, Fabrication and Assembly Process Principles
Vern Solberg, Solberg Technical Consulting
££
HIGH-SPEED DESIGN
From DC to AC – Power Integrity and Decoupling Primer for PCB Designers
Ralf Bruening, Zuken
£££
Differential Pair Routing for SI and EMI Control
Rick Hartley, RHartley Enterprises
££
Mechanical Design to Control EMI
Rick Hartley, RHartley Enterprises
££
Circuit Grounding to Control Noise and EMI
Rick Hartley, RHartley Enterprises
£
IoT PC Board Design and Layout
Rick Hartley, RHartley Enterprises
££
PC Board Design of Power Distribution and Decoupling
Rick Hartley, RHartley Enterprises
££
RF and Mixed Signal PCB Layout
Rick Hartley, RHartley Enterprises
PSIJ Effect on SI Analysis of LP4x 4267 Mbps Speed in HHHL PCIe Card
Ashish Gupta, Intel India
££
Embedded Capacitance Technology Concept: Design, Implementation, and Processing Guidelines
Robert Carter, Oak-Mitsui Technologies, and Benjamin Jordan, Altium
£££
The Basics of PCB Fabrication (101)
Paul Cooke, AGC Nelco – Taconic
££
The PCB Design Process from Cradle to Grave
Daniel J. Smith, Raytheon SAS
££
Semi-Additive PCB Processing Resets the Technology Curve
Mike Vinson, Averatek, and Kelly Dack, KeyTronic
£££
Causes of Signal Degradation in PCB Transmission Lines
Atar Mittal, Sierra Circuits
£
PCB Stackup Design and Materials Selection
Bill Hargin, Z-zero
££
Millimeter-Wave Concepts can be used to Optimize the Performance of High-Speed Digital Circuits
John Coonrod, Rogers Corp.
££
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