Page 16 - PCB-West-2020-Catalog
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OVERVIEW OF PCB WEST 2020 TECHNICAL CONFERENCE BY SUBJECT
£Beginner £ Intermediate £Advanced
HIGH-SPEED DESIGN - CONT.
Electromagnetic Fields for Normal Folks: Show Me the Pictures and Hold the Equations, Please!
PCB Design Techniques to Improve ESD Robustness
Effective PCB Design: Techniques to Improve Performance
Power Delivery System Design
Printed Circuit Board Stackup Design for High-Performance Products
Novel Power Distribution System Design
Feeding the Beast: Consumption-Based PCB design
The Butterfly Effect in PCB Design: Optimization of High-speed Lines for an FMC Carrier Board
The Mystery of Bypass Capacitors
An Intuitive Approach to Understanding Basic High-Speed Layout How to Fight Magnetic Noise Gremlins
Next-Generation Materials: High-Speed, RF and HDI Designs Place and Route for Dense High-Speed and RF Circuits
LAMINATES
PCB Stackup Design and Materials Selection
Millimeter-Wave Concepts can be used to Optimize the Performance of High-speed Digital Circuits
Next-Generation Materials: High-Speed, RF and HDI Designs Place and Route for Dense High-Speed and RF Circuits Power Delivery System Design
PCB Problem Solving – PCB 102
Printed Circuit Board Stackup Design for High-Performance Products
The Basics of PCB Fabrication (101)
Embedded Capacitance Technology Concept: Design, Implementation, and Processing Guidelines
PCB Design and Assembly Process Strategy for High Density CSP, WLP, 2D and 3D Semiconductor Package Technology
The Current State of Fabrication and Assembly – Dispelling Myths, Correcting Misunderstandings, and Explaining Mysteries
PCB DESIGN/LAYOUT/PLACEMENT
Power Delivery System Design
Printed Circuit Board Stackup Design for High-Performance Products
PSIJ Effect on SI Analysis of LP4x 4267 Mbps Speed in HHHL PCIe Card
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Daniel Beeker, NXP Semiconductor
Daniel Beeker, NXP Semiconductor
Daniel Beeker, NXP Semiconductor
Lee Ritchey, Speeding Edge
Lee Ritchey, Speeding Edge
Daniel Beeker, NXP Semiconductor
Daniel Beeker, NXP Semiconductor
Jamie Pacamarra, Analog Devices
Keven Coates, Geospace Technologies
Keven Coates, Geospace Technologies
Keven Coates, Geospace Technologies
Michael R. Creeden, CID+, Insulectro
Michael R. Creeden, CID+, Insulectro
Bill Hargin, Z-zero
John Coonrod, Rogers Corp.
Michael R. Creeden, CID+, Insulectro
Michael R. Creeden, CID+, Insulectro
Lee Ritchey, Speeding Edge
Paul Cooke, AGC-Nelco Taconic
Lee Ritchey, Speeding Edge
Paul Cooke, AGC Nelco – Taconic
Robert Carter, Oak-Mitsui Technologies, and Benjamin Jordan, Altium
Vern Solberg, Solberg Technical Consulting
Shane Shuffield, Advanced Assembly, and Mark Hughes, Advanced Assembly
Lee Ritchey, Speeding Edge
Lee Ritchey, Speeding Edge
Ashish Gupta, Intel India
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