Page 17 - PCB-West-2020-Catalog
P. 17

£Beginner £ Intermediate
Causes of Signal Degradation in PCB Transmission Lines
Embedded Capacitance Technology Concept: Design, Implementation, and Processing Guidelines
Fundamentals of Geometric Dimensioning and Tolerancing (GD&T) for the PWB Designer
Differential Pair Routing for SI and EMI Control Mechanical Design to Control EMI
Circuit Grounding to Control Noise and EMI IoT PC Board Design and Layout
PC Board Design of Power Distribution and Decoupling RF and Mixed Signal PCB Layout
Flexible and Rigid Flex Circuits: Design, Fabrication and Assembly Process Principles
Semi-Additive PCB Processing Resets the Technology Curve Hair-Raising Footprint Horror Stories – and How to Avoid Them Accelerate PCB Platforms Layout Design Using AI Smart Router The Basics of PCB Fabrication (101)
From DC to AC – Power Integrity and Decoupling Primer for PCB Designers
Heterogeneous OR Mixed-Up Assembly
Design and Implementation of Copper Coin Application Over Thermal VIA (Vertical Interconnect Access) Structure for Thermal Management up to 12W Device Application
PCB Problem Solving – PCB 102
Flexible Circuits: Design Through Test with Lessons Learned
A Practical Guide to RF and Microwave PCB Design
Millimeter-Wave Concepts can be used to Optimize the Performance of High-speed Digital Circuits
The Current State of Fabrication and Assembly – Dispelling Myths, Correcting Misunderstandings, and Explaining Mysteries
Design-for-Manufacture and Design-for-Assembly Fundamentals that Decrease Holds and Lower the Cost of Manufacturing
The Mystery of Bypass Capacitors
An Intuitive Approach to Understanding Basic High-Speed Layout How to Fight Magnetic Noise Gremlins
Atar Mittal, Sierra Circuits
Robert Carter, Oak-Mitsui Technologies, and Benjamin Jordan, Altium
Gary Ferrari, FTG
Rick Hartley, RHartley Enterprises
Rick Hartley, RHartley Enterprises
Rick Hartley, RHartley Enterprises
Rick Hartley, RHartley Enterprises
Rick Hartley, RHartley Enterprises
Rick Hartley, RHartley Enterprises
Vern Solberg, Solberg Technical Consulting
Mike Vinson, Averatek, and Kelly Dack, KeyTronic Elizabeth Bustamante, SnapEDA
Naveid Rahmatullah, Intel, and Xiao Ming Gao, Intel Paul Cooke, AGC Nelco – Taconic
Ralf Bruening, Zuken
Phil Marcoux, PPM Associates
Marcus Miguel V. Vicedo, Analog Devices, and Richard Legaspino, Analog Devices
Paul Cooke, AGC-Nelco Taconic
Mark Finstad, Flexible Circuit Technologies, and Nick Koop, TTM Technologies
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                                                                    Benjamin Jordan, Altium John Coonrod, Rogers Corp.
Shane Shuffield, Advanced Assembly, and Mark Hughes, Advanced Assembly
Mark J. Hughes, Royal Circuit Solutions, and Elijah Gracia, Royal Circuit Solutions
Keven Coates, Geospace Technologies Keven Coates, Geospace Technologies Keven Coates, Geospace Technologies
                        PCB Stackup Design and Materials Selection
Bill Hargin, Z-zero
        Electromagnetic Fields for Normal Folks: Show Me the Pictures and Hold the Equations, Please!
Daniel Beeker, NXP Semiconductor
    Effective PCB Design: Techniques to Improve Performance
Daniel Beeker, NXP Semiconductor

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