Page 20 - PCB-West-2020-Catalog
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 OVERVIEW OF PCB WEST 2020 TECHNICAL CONFERENCE BY SUBJECT
£Beginner £ Intermediate Electromagnetic Fields for Normal Folks: Show Me the Pictures and
Hold the Equations, Please!
From DC to AC – Power Integrity and Decoupling Primer for PCB Designers
PCB Design Techniques to Improve ESD Robustness
The Mystery of Bypass Capacitors
An Intuitive Approach to Understanding Basic High-Speed Layout
How to Fight Magnetic Noise Gremlins
Embedded Capacitance Technology Concept: Design, Implementation, and Processing Guidelines
Causes of Signal Degradation in PCB Transmission Lines
PSIJ Effect on SI Analysis of LP4x 4267 Mbps Speed in HHHL PCIe Card
PCB Stackup Design and Materials Selection
Design and Implementation of Copper Coin Application Over Thermal VIA (Vertical Interconnect Access) Structure for Thermal Management up to 12W Device Application
Effective PCB Design: Techniques to Improve Performance
The PCB Design Process from Cradle to Grave
Novel Power Distribution System Design
Millimeter-Wave Concepts can be used to Optimize the Performance of High-Speed Digital Circuits
Feeding the Beast: Consumption-Based PCB design
The Butterfly Effect in PCB Design: Optimization of High-speed Lines for an FMC Carrier Board
TEST
PCB Design Techniques to Improve ESD Robustness The PCB Design Process from Cradle to Grave
Millimeter-Wave Concepts can be used to Optimize the Performance of High-speed Digital Circuits
From Smart Factory Automation to Digital Twin Standard: Ushering a New Era for Design and Manufacturing
Power Delivery System Design
Place and Route for Dense High-Speed and RF Circuits PCB Problem Solving – PCB 102
THERMAL MANAGEMENT
Design and Implementation of Copper Coin Application Over Thermal VIA (Vertical Interconnect Access) Structure for Thermal Management up to 12W Device Application
£Advanced
Daniel Beeker, NXP Semiconductor Ralf Bruening, Zuken
Daniel Beeker, NXP Semiconductor
Keven Coates, Geospace Technologies
Keven Coates, Geospace Technologies
Keven Coates, Geospace Technologies
Robert Carter, Oak-Mitsui Technologies, and Benjamin Jordan, Altium
Atar Mittal, Sierra Circuits Ashish Gupta, Intel India
Bill Hargin, Z-zero
Marcus Miguel V. Vicedo, Analog Devices, and Richard Legaspino, Analog Devices
Daniel Beeker, NXP Semiconductor Daniel J. Smith, Raytheon SAS Daniel Beeker, NXP Semiconductor John Coonrod, Rogers Corp.
Daniel Beeker, NXP Semiconductor Jamie Pacamarra, Analog Devices
     SI/PI - CONT.
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                                                    Daniel Beeker, NXP Semiconductor
 Daniel J. Smith, Raytheon SAS
   John Coonrod, Rogers Corp.
 Michael Ford, Aegis Software, and Hemant Shah, Cadence
 Lee Ritchey, Speeding Edge
 Michael R. Creeden, CID+, Insulectro
 Paul Cooke, AGC-Nelco Taconic
                     Marcus Miguel V. Vicedo, Analog Devices, and Richard Legaspino, Analog Devices
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