Page 21 - PCB-West-2020-Catalog

TECHNICAL CONFERENCE PROGRAM
Tuesday, Sept. 8th
10:00 am – 6:00 pm
1: The Basics of PCB Design
Susy Webb, Design Science
Technical sessions at conferences often emphasize the latest techniques and technologies, but those classes are often too in-depth for a novice designer, and don’t speak to the questions from the engineers who need to design their own boards. This class features an overview of the entire process of designing a board, from start to finish. We will begin with creating manufacturable footprints that meet the IPC specs. Then we will address some common placement techniques like floor planning, color-coding, flow, orientation, and placement to set up routing. We will follow that with a discussion of planes and stackups and how to configure them to get the best results for parts and signals. Next, we move on to some fanout and routing techniques that are helpful for completing the design connections to meet the number one design rule: good electrical performance. We will complete the process by discussing some manufacturability concerns that can be affected by the way the board is designed, some finishing issues, and sending out good documentation that the manufacturers can easily understand and use.
Who should attend: PCB Designer/Design Engineer Target audience: Beginner, Intermediate
2: A Practical Guide to RF and Microwave PCB Design
Benjamin Jordan, Altium
This is a session for embedded engineers and PCB designers who have never done RF board layout but are curious and want to have a go at it. It is not for experienced microwave engineers. This practical workshop will introduce (or reintroduce) basic math associated with the topic, but the goal is to be practical and intuitive, not theoretical and esoteric. We will visualize the elements available and build and test using desktop prototyping gear.
The class is broken into two sessions (morning and afternoon). Session 1: Back to basics electromagnetic recap; transmission lines - what you need to know; EM and T-line visualizations; PCB materials and conductors for RF and microwave. Session 2: Essential transmission line evaluation skills (VSWR, S-parameters, basic simulation and visualization); introduction to the Smith chart, and how to match impedance; practical design exercise with introduction to the VNA; using the desktop CNC to mill practical prototypes (and tips to mill with accuracy); introduction to PCB antenna types.
Who should attend: PCB Designer/Design Engineer, System Designer, Hardware Engineer, SI Engineer Target audience: Beginner, Intermediate
10:00 am – 5:00pm
3: Printed Circuit Board Stackup Design for High-Performance Products
Lee Ritchey, Speeding Edge
This comprehensive seminar covers how to design a PCB stackup to optimize performance while attaining the lowest cost possible. With the advent of very high-speed signaling, along with multiple very high-current power supply rails, it is necessary to understand how materials behave and how PCBs are fabricated in order to arrive at a PCB stackup that results in a “right the first time” design. The seminar draws from the speaker’s long experience designing PCB stackup for products ranging from video games to supercomputers. It draws on the results of dozens of test PCBs used to characterize materials from a loss and high-speed skew perspective.
Who should attend: PCB Designer/Design Engineer, System Designer, Hardware Engineer, SI Engineer, Test Engineer, Fabricator Engineer/Operator, Assembly Engineer/Operator
Target audience: Beginner, Intermediate, Advanced
10:00 am – 12:00 pm
4: Differential Pair Routing for SI and EMI Control
Rick Hartley, RHartley Enterprises
Differential pairs have been used in PCBs for years to carry high-speed serial and high-speed parallel data in a variety of bus formats. Many board designers and engineers believe the rules for differential pairs are the same in a PCB as in cable or twisted pairs of wires. This is usually not the case!
This course will cover the advantages of differential pairs vs. single-ended lines, which differential pair format gives the best impedance control, what is the right spacing between the lines of a pair, crosstalk between differential pairs, what is important in differential pair routing, how much timing skew is really acceptable, the impact of material type and the impact of vias on signal integrity and EMI.
Who should attend: PCB Designer/Design Engineer, System Designer, Hardware Engineer, SI Engineer Target audience: Beginner, Intermediate
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