Page 25 - PCB-West-2020-Catalog
P. 25

 1:00 pm – 4:30 pm
8: IoT PC Board Design and Layout
Rick Hartley, RHartley Enterprises
Circuit boards for the IoT world (Internet of Things) are often driven by the need for low power dissipation, low cost (which drives very low layer count), moderate to high-density and mixed-signal applications. This combination of needs can make board design an extreme challenge. Creating a 1-, 2- or 4-layer board, with excellent signal integrity and low noise/interference and no EMI issues can, by itself, be a very serious challenge. This 3.5-hour course will discuss how to understand when it is necessary to control impedance of lines, how to do it cost-effectively, proper setup of routed lines to keep circuit energy from spreading (preventing interference), even on a one-layer board, design of antenna into the PCB, circuit grounding in low-layer-count boards, power distribution without the benefit of power planes, ground bounce, cross talk with low layer count and design to optimize manufacturability of low-layer-count PCBs.
Who should attend: PCB Designer/Design Engineer, System Designer, Hardware Engineer, SI Engineer Target audience: Beginner, Intermediate
9: Flexible Circuits: Design Through Test with Lessons Learned
Mark Finstad, Flexible Circuit Technologies, and Nick Koop, TTM Technologies
This course will cover the entire gamut of flexible and rigid-flex circuits from two of the most recognized names in the flexible circuit industry: Mark Finstad (co-chair of IPC-2223) and Nick Koop (co-chair of IPC-6013). Topics covered will include mechanical design/material selection, cost drivers, bending and forming concerns, testing, and issues unique to rigid-flex. This course also includes a complete virtual plant tour of a flexible circuit manufacturing facility to help attendees understand the manufacturing processes. Throughout the presentation, the instructors will share real-life stories of flexible circuit applications gained over 35+ years in the industry. Some are success stories, others not so much, but all provide excellent lessons learned. The instructors also welcome and encourage questions and enjoy wandering off-course with lively interactive discussions on specific topics from the class.
Who should attend: PCB Designer/Design Engineer, Test Engineer, Fabricator Engineer/Operator, Assembly Engineer/Operator Target audience: Beginner, Intermediate
10: Effective PCB Design: Techniques to Improve Performance
Daniel Beeker, NXP Semiconductor
Tired of failing EMC certification over and over? Join the crowd. Shrinking IC geometries and a resulting increase in switching speeds make designing compliant printed circuit boards more challenging than ever. We need a new design methodology to change this unacceptable status quo, one based on electromagnetic field physics. This training module presents a basic introduction to EM fields and provides guidelines for building successful, cost-effective printed circuit boards. This presentation includes example designs and test results.
Who should attend: PCB Designer/Design Engineer, System Designer, Hardware Engineer, SI Engineer Target audience: Beginner, Intermediate, Advanced
3:00 pm – 5:00 pm
11: Next-Generation Materials: High-Speed, RF and HDI Designs
Michael R. Creeden, CID+, Insulectro
With this presentation, attendees will learn how materials matter in the 5G-world. From rigid laminates, copper styles and properties, flex materials, sintered paste OrMet for any-layer vias: all play a part of the design, manufacturing and performance of products. Attendees will receive a good understanding of basic EM theory, with a strong emphasis on material selection. This will cover aspects affecting interconnections and their respective EM fields. The design flow is from the start of the layout cycle all the way to the generation of deliverables and then into manufacturing. Emphasis is on the role that materials play to make a circuit cost-effective, perform well and be a reliable high-yield product. We will touch on all types of circuit technologies in many market segments. Focus is on integration between design and manufacturing early in the development cycle, to build a high-reliability product that is correct-by-construction and performs on Revision-1.
Who should attend: PCB Designer/Design Engineer, System Designer, Hardware Engineer, SI Engineer, Fabricator Engineer/Operator Target audience: Beginner, Intermediate, Advanced
6:00 pm – 8:00 pm
Printed Circuit Engineers Association Meeting
Come learn about the new Printed Circuit Engineering Association, an international network of engineers, designers, and anyone related to printed circuit development. Its mission is to promote printed circuit engineering as a profession and to encourage, facilitate, and promote the exchange of information and the integration of new design concepts through communications, seminars, workshops, and professional certification through a network of local and regional PCEA-affiliated groups.

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