Page 33 - PCB-West-2020-Catalog
P. 33

 signals, in this case, at rates up to 16Gb/s. For these signals to retain their integrity, a thorough high-speed PCB design must be implemented. But there are limitations that prevent easy high-speed routing for this design.
Since this FMC is the carrier board for an RF SOM and is designed for compatibility with an industry standard form factor for high pin count (HPC) FMC, there are components that are fixed and cannot be moved or rotated freely. With limited freedom to move components, there are high-speed lines that take longer routes. Longer traces create large current loop areas, increasing the chances for delays and noise. The challenge is to optimize the design’s high-speed lines while taking into consideration the mechanical restrictions, trace lengths, and stackup limitations through simulations. To address these issues, three trials were simulated with the first one sticking to the original design, second with modified differential pair setup and stackup heights, and the third one with modified differential pair return path vias from inline to rectangular and implementation of vias in pads. Insertion loss, return loss, and their eye diagrams were gathered and compared to analyze how each change in the physical characteristics of the board affects the overall signal quality of the lines concerned. Insertion loss improved by -13dB, return loss by -21dB, and the eye diagram widening up to almost twice the size from the original. Note a small change in the design’s copper features contributed greatly to achieve the performance required from this application. With these results, it can be concluded that it doesn’t take rocket science to handle high-speed signals. With small changes and proper execution, PCB designers will be able to deliver a quality design, all while considering overall cost and board manufacturability.
Who should attend: PCB Designer/Design Engineer Target audience: Beginner, Intermediate
 F2: Millimeter-Wave Concepts Can be Used to Optimize the Performance of High-Speed Digital Circuits
John Coonrod, Rogers Corp.
Understanding millimeter-wave (mmWave) concepts can benefit RF designers, high-speed digital circuit designers and fabricators. In the RF industry, as frequency increases many circuit properties become increasingly difficult to control. Circuits used at mmWave frequencies (above 30GHz) have smaller wavelengths. Due to this small wavelength, circuit performance can be affected by very small circuit anomalies that in the past could have been ignored at lower frequencies. These small circuit anomalies can be caused by a variety of issues, such as normal variations of several processes for PCB fabrication, circuit designs being sensitive to the anomalies and normal variation of certain high-frequency material properties.
This presentation will give a basic overview of what to consider in order to optimize the circuit performance at mmWave frequencies. For high-speed digital circuits, the presentation will include information on how mmWave concepts can be used to optimize high-speed digital circuits as the Nyquist frequencies approach the RF mmWave frequencies.
Who should attend: PCB Designer/Design Engineer, System Designer, Hardware Engineer, SI Engineer, Test Engineer Target audience: Beginner, Intermediate
 10:00 am – 11:00 am
F3: Electromagnetic Fields for Normal Folks: Show Me the Pictures and Hold the Equations, Please!
Daniel Beeker, NXP Semiconductor
The material presented will be focused on the physics of electromagnetic energy basic principles, presented in easy-to-understand language with plenty of diagrams. Attendees will discover how understanding the behavior of EM fields can help to design PCBs that will be more robust and have better EMC performance. This is not rocket science, but an easy to understand application of PCB geometry. It’s all about the space!
Who should attend: PCB Designer/Design Engineer, System Designer, Hardware Engineer, SI Engineer, Test Engineer, CEO/COO/Sales/Marketing Target audience: Beginner, Intermediate, Advanced
 F4: Bringing Electronics Innovations to Market Faster with a Software-Based PCBA Manufacturing Model
Dan Radler, Tempo Automation
The world’s most innovative brands and established corporate symbols are building rockets, autonomous vehicles, medical devices, robots, and consumer electronics as quickly as they can innovate, but many are trying to build the tech of tomorrow while still relying on dated contract manufacturing processes for PCB prototyping.
Regardless of the industry or application, it takes 14 iterations to reach the final PCB design in creating the average electronics device. With a traditional PCB assembly manufacturing model, each iteration takes up to three weeks to complete, causing a bottleneck in the design and manufacturing process. Another downfall in the traditional PCBA manufacturing process is that engineers receive little insight into the design and manufacture of their boards, which can potentially cause design flaws or engineering issues that are often discovered at the end of the design-built-test process, causing even more delay in bringing the innovation to fruition. In modern PCBA, there cannot be a disconnect between the humans and the machines working to bring designs to market as quickly as possible.
Leveraging a software-based connected factory platform for PCBA not only fills the communication gap between designer and manufacturer, it accelerates the iteration process to bring industry-leading electronics to market quicker and with greater quality and accuracy. And by leveraging IIoT to automate the flow of information from the engineer’s design to the machines and the people on the smart factory floor, manufacturers can create in a continuous cycle of design,

   31   32   33   34   35