Page 44 - PCB-West-2020-Catalog
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                 SPEAKER BIOS
 MARK FINSTAD is senior application engineer at Flexible Circuit Technologies. He co-chairs the IPC-2223 Flexible Circuit Design standard, sits on IPC-6013, IPC-4202, IPC-4203 and IPC-4204 committees, and has over 35 years of experience designing and manufacturing flexible circuits for commercial, medical, and military/ avionics applications. He has authored articles in numerous trade magazines, and currently coauthors the "Ask the Flexperts" column for PCD&F magazine with Nick Koop.
MICHAEL FORD is senior director of emerging industry strategy at Aegis Software. Starting his career with Sony, including eight years working in Japan, he has been instrumental in creating and evolving revolutionary software solutions for assembly manufacturing. Today, he is an established thought leader for Industry 4.0 and digital smart factories, an active contributor to IPC industry standards, including the Connected Factory Exchange (CFX), traceability and secure supply-chain. In 2020, he received the IPC President’s Award for contributions to several standards that together now are leading to the formation of the new IPC Digital Twin standard. Michael also regularly contributes articles, columns and blogs in several leading industry publications.
XIAO-MING GAO, PH.D., has been working at Intel for 20 years and has extensive experience in signal and system, I/O circuit design, signal and power integrity analysis, and high-speed platform design. He holds B.S., M.S., and Ph.D. degrees in electrical engineering. He has four patents and other pending applications.
ELIJAH GRACIA IS A CAD/CAM engineer at Royal Circuit Solutions. He has spent the past six years fabricating PCBs and working one-on-one with electrical engineers to improve their designs, with a focus on designing for manufacturability.
ASHISH GUPTA is SI-PI tech lead at Intel, responsible for system-level signal/power integrity analysis. Prior to Intel, he worked at Cadence and Ericsson, where he worked in analog/RF design, antenna design and tool/methodology. He has authored several IEEE papers in the field of analog/RF, antenna design and high-speed design. He holds a master’s in RF and microwave from the Indian Institute of Technology, Kanpur.
BILL HARGIN is founder of Z-zero, a manufacturer of software for PCB stackup planning, material selection and characterization. He has authored multiple articles on signal integrity, is a regular columnist for PCD&F, and more than 10,000 engineers and PCB designers worldwide have taken Hargin’s workshops on high-speed PCB design. With 25 years of experience dealing with PCB signal integrity, Hargin served as director of marketing for Mentor Graphics’ HyperLynx SI software and director of North American marketing for Nan Ya Plastic’s PCB laminate division.
RICK HARTLEY, a retired senior principal engineer at L-3 Avionics Systems, is principal of RHartley Enterprises, through which he consults and teaches internationally. His focus is on correct design of circuits and PC boards to prevent and/or resolve EMI, noise and signal integrity problems. He has consulted with major corporations in the US and 14 other countries. His career has focused on computers, telecommunications and aircraft avionics, as well as medical, automotive and appliances. He has taught seminars at numerous conferences, including the IEEE EMC Symposium, PCB West, IPC Apex Expo and others. He is on the board of directors of the Printed Circuit Engineering Association, a past member of the Editorial Review Board of Printed Circuit Design magazine and has written numerous technical papers and articles on methods to control noise, EMI and signal integrity.
MARK HUGHES is research director at Royal Circuit Solutions. Prior to Royal Circuit, he was technical editor for AllAboutCircuits. com and taught physics for 14 years. He holds bachelor’s and master’s degrees.
BEN JORDAN, CID+, is director of technical marketing at Altium, where he has worked since 2004 in R&D, technical support, and now as a marketing product and subject matter expert. He has over 20 years of experience in embedded systems, FPGA and PCB design. In his spare time, he loves to experiment with board-level electronics and microcontrollers, as well as play guitar.
NICK KOOP is director of application engineer at TTM Technologies. He has developed and applied advanced PCB technologies to support a wide range of medical, military, and global security applications. He is vice chairman of the IPC Flexible Circuits Committee and co- chair for the IPC-6013 Qualification and Performance Specification for Flexible Printed Boards Subcommittee. Koop has over 35 years of experience in design, manufacture, and management in the flexible circuit industry. He coauthors the "Ask the Flexperts" column in PCD&F.
RICHARD LEGASPINO is a senior PCB engineer at Analog Devices, where he leads the simulation team that supports signal and power integrity simulation requests across ADI sites. He joined Analog Devices Philippines in 2006 as test manufacturing engineer. He has three years’ experience in hardware engineering at Acer Taiwan and five years’ experience as test engineer at Teradyne Philippines. He has a bachelor’s in electronic and communications engineering.
PHIL MARCOUX has been involved with heterogeneous and related product design and manufacturing for over 40 years. He continues as a mentor for companies exploring new methods. The first company he founded suffered the consequences of poor heterogeneous product construction and only managed to survive by becoming one of the first full-service SMT design and manufacturing facilities in the US. After successfully selling that company, Marcoux went on to found one of the first chip-scale and wafer-level-packaging companies. This company was responsible for the creation of some

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