Page 6 - PCB-West-2020-Catalog

SCHEDULE AT-A-GLANCE
Tuesday, September 8DAY, SEPTEMBER 9
TITLE/TIME
SPEAKER
10:00 am – 6:00 pm
1: The Basics of PCB Design
Susy Webb, Design Science
2: A Practical Guide to RF and Microwave PCB Design
Benjamin Jordan, Altium
10:00 am - 5:00 pm
3: Printed Circuit Board Stackup Design for High-Performance Products
Lee Ritchey, Speeding Edge
10:00 am - 12:00 pm
4: Differential Pair Routing for SI and EMI Control
Rick Hartley, RHartley Enterprises
5: Semi-Additive PCB Processing Resets the Technology Curve
Mike Vinson, Averatek, and Kelly Dack, KeyTronic
6: Causes of Signal Degradation in PCB Transmission Lines
Atar Mittal, Sierra Circuits
12:00 pm – 1:00 pm LUNCH-N-LEARN - Sponsored by Summit Interconnect (Tuesday Conference attendees only)
1:00 pm - 3:00 pm
7: From Smart Factory Automation to Digital Twin Standard: Ushering a New Era for Design and Manufacturing
Michael Ford, Aegis Software, and Hemant Shah, Cadence
1:00 pm - 4:30 pm
8: IoT PC Board Design and Layout
Rick Hartley, RHartley Enterprises
9: Flexible Circuits: Design Through Test with Lessons Learned
Mark Finstad, Flexible Circuit Technologies, and Nick Koop, TTM Technologies
10: Effective PCB Design: Techniques to Improve Performance
Daniel Beeker, NXP Semiconductor
3:00 pm - 5:00 pm
11: Next-Generation Materials: High-Speed, RF and HDI Designs
Michael R. Creeden, CID+, Insulectro
6:00 pm - 8:00 pm
Printed Circuit Engineers Association Meeting
Wednesday, September 9DAY, SEPTEMBER 9
10 am – 2pm BOOTH BARISTA, sponsored by Zuken
10:00 am - 2:30 pm
12: Embedded Capacitance Technology Concept: Design, Implementation, and Processing Guidelines
Robert Carter, Oak-Mitsui Technologies, and Benjamin Jordan, Altium
10:00 am - 12:00 noon
13: RF and Mixed Signal PCB Layout
Rick Hartley, RHartley Enterprises
14: An Intuitive Approach to Understanding Basic High-Speed Layout
Keven Coates, Geospace Technologies
15: From DC to AC – Power Integrity and Decoupling Primer for PCB Designers
Ralf Bruening, Zuken
12:00 pm – 1:00 pm LUNCH ON SHOW FLOOR, Sponsored by Sierra Circuits
1:30 pm - 3:30 pm
16: Novel Power Distribution System Design
Daniel Beeker, NXP Semiconductor
1:30 pm - 5:00 pm
17: Circuit Grounding to Control Noise and EMI
Rick Hartley, RHartley Enterprises
18: PCB Design and Assembly Process Strategy for High Density CSP, WLP, 2D and 3D Semiconductor Package Technology
Vern Solberg, Solberg Technical Consulting
19: Designing the Signal Return Path
Susy Webb, Design Science
20: The PCB Design Process from Cradle to Grave
Daniel J. Smith, Raytheon SAS
21: Place and Route for Dense High-Speed and RF Circuits
Michael R. Creeden, CID+, Insulectro
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