Page 41 - PCB-West-2020-Catalog

TECHNICAL CONFERENCE PROGRAM
will be presented for performing quantitative analyses of the transmission line capability based on the impedance and length, determining the number of wave cycles needed to deliver the required charge. This perspective can be used in the initial design phase or to evaluate existing designs. EMC test results from a production design, MPC-LS-VNP-MOD, using this approach, will be presented.
Who should attend: PCB Designer/Design Engineer, System Designer, Hardware Engineer, SI Engineer Target audience: Beginner, Intermediate, Advanced
1:00 pm – 4:30 pm
30: PC Board Design of Power Distribution and Decoupling
Rick Hartley, RHartley Enterprises
Power distribution in PCBs is the foundation around which all things work in the circuit. If this is not designed correctly, the entire circuit is at risk from noise and signal integrity issues, to say nothing of the severely increased possibilities of EMI. Low impedance in the structure, across the harmonic frequency range of a digital circuit is critical. A number of subtle layout techniques will have major impact on power bus impedance, inductance in particular. This 3.5-hour course will cover power bus target impedance, inductance of vias, planes and capacitors, mounting inductance of capacitors, energy delivery to IC cores, the “Bandini Mountain,” best mounting of capacitors based on board stack-up, the importance of IC pinout, placement of decoupling in both low-layer-count and high-layer- count boards, real performance of capacitors (vs. myth), how much decoupling, multiple capacitor values, how to minimize anti-resonant peaks, ferrites in the power bus, analog and RF decoupling, the importance of power/ground plane pairs, ultra-thin power and ground plane pairs and the importance of board stack.
Who should attend: PCB Designer/Design Engineer, System Designer, Hardware Engineer, SI Engineer Target audience: Intermediate, Advanced
31: The Basics of PCB Fabrication (101)
Paul Cooke, AGC Nelco - Taconic
With ever-decreasing geometries and increased density, today’s PCBs are extremely complex. Fabricators are continually under pressure to keep up with the capabilities needed to produce these types of products. This seminar looks at how a PCB is fabricated and the challenges the fabricator faces to achieve the design intent and meet customer and industry standards. We will examine the processes needed to form microvias, image μBGAs, plate copper in holes the thickness of a human hair and select surface finishes needed for very tight pitch components. The half-day seminar will be interactive with the audience to ensure all questions related to more in-depth PCB fabrication and processes are answered.
Who should attend: PCB Designer/Design Engineer, Hardware Engineer, Fabricator Engineer/Operator, CEO/COO/Sales/Marketing Target audience: Beginner, Intermediate
32: Routing Digital Boards to Avoid Problems
Susy Webb, Design Science
There are many ways to route a PCB, some much more effective for signals than others. The first design rule is that the board must work properly, so it is important to have a plan that addresses good signal quality and crosstalk control, no matter what the frequency. In this presentation, we will start with a bit of the science to set up the reasoning for routing a certain way, then move into return current and impedance control, with a discussion of what affects those things. Starting route with an effective fanout plan sets up what is to come, and we will also explore general routing priorities and concerns. To avoid problems, routing schemes will be addressed, along with spacing, differential pair and length matched routing. Last, pros and cons of hand routing, semiautomation, and autorouting will be examined.
Who should attend: PCB Designer/Design Engineer Target audience: Intermediate
33: Heterogeneous OR Mixed-Up Assembly
Phil Marcoux, PPM Associates
In recent years heterogeneous assembly has grown in interest as a possible replacement for SMT assembly and as a solution for reducing the area needed for complex electronic devices. Heterogeneous devices combine packed devices, unpackaged devices, bare chips, chiplets, deposits, components and intricate substrate materials and designs. In some cases heterogeneous devices are more economical and offer faster time to market and lower product costs than custom and semi-custom integrated circuits.
The successful design, procurement, and manufacturing of a heterogeneous product is exacting, requiring the interaction of multiple vendors, marginally adequate design and testing tools, and often reluctant component vendors. For those designers and product managers willing to understand and endure the road to product completion, the rewards can be great. Missteps can be career-limiting.
This seminar will cover the basic and advanced assembly options, component variations, and common substrate types. It will review the latest changes to the Heterogeneous Integration Roadmap (HIR) developed by the multi-standards organizations.
Who should attend: PCB Designer/Design Engineer, System Designer, Test Engineer, Fabricator Engineer/Operator, Assembly Engineer/Operator
Target audience: Beginner, Intermediate
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