Page 42 - PCB-West-2020-Catalog

TECHNICAL CONFERENCE PROGRAM
Friday, Sept. 11
10:00 pm – 4:00 pm
34: Power Delivery System Design
Lee Ritchey, Speeding Edge
With the advent of ICs with multiple power rails at very high currents, the design of the power delivery system in a modern product is often more difficult than routing the PCB to ensure good signal integrity. The power delivery system must deliver power to devices at frequencies from D to hundreds of megahertz. The application notes that accompany most ICs do not contain adequate information to allow a designer to get the PDS correctly designed.
This course is aimed at providing the information needed to get the job done right. It draws on the speaker’s experience designing hundreds of power delivery systems for products ranging from satellites to super computers. It contains a very large number of test PCBs used to determine how well each component will perform when used in a PDS.
Who should attend: PCB Designer/Design Engineer, System Designer, Hardware Engineer, SI Engineer, Test Engineer, Fabricator Engineer/Operator, Assembly Engineer/Operator
Target audience: Beginner, Intermediate, Advanced
10:00 am – 6:00 pm
35: PCB Problem Solving - PCB 102
Paul Cooke, AGC-Nelco Taconic
This course will address advanced problem solving of printed wiring board defects. Some defects, such as interconnect separation, delamination, wedge voids, plating folds, micro-voids, surface pitting, and hole wall pull-away, carry significant costs. Many are difficult to solve because the root cause may not be readily apparent, and multiple factors may contribute. This course will explore the most intricate of these factors and how the interrelationship of up- and downstream processes contribute to scrap product. What effect does drilling have on hole wall quality and the subsequent metallization process? Participants will learn how to recognize problems like this and take corrective action. The course will explore a myriad of electrodeposition defects, such as mouse bites, pitting, and domed or crown plating. Solderability and assembly-related issues such as outgassing, black pad, creep corrosion and blow holes will also be discussed. The course will conclude with a discussion on imaging, including liquid-photoimageable solder masks. Strategies to solve solder mask peeling, poor circuit trace coverage, skips, bubbles, and poor adhesion in nickel gold plating will be discussed. Solder mask equipment and its effect on solder mask quality will also be explored. In addition, over 200 images of defects will be presented.
Attendees will learn how to recognize and solve lamination and other multilayer-related defects; electrodeposition defects: mouse bites, pitting, nodules, crown or dome plating, dog bone defects; copper plating reliability; how to improve plating distribution and throwing power; metallization: microvoids/voiding, interconnect separation, hole wall pull away, and assembly issues; black pad phenomenon: new details on its cause and how to eliminate it; imaging: defects, surface preparation, solder mask issues and defects, process control. Also covered will be other final finish-related defects: creep corrosion, champagne bubble effect, solder mask interfacial attack. Participants should have some knowledge of the PCB fabrication process. This course will directly benefit those involved in printed circuit board fabrication and assembly. In addition, PCB end-users and designers will gain significant knowledge about PCB-related defects.
Who should attend: PCB Designer/Design Engineer, Fabricator Engineer/Operator, Assembly Engineer/Operator, CEO/COO/Sales/Marketing Intermediate, Advanced
1:00 pm – 4:30 pm
36: Flexible and Rigid Flex Circuits: Design, Fabrication and Assembly Process Principles
Vern Solberg, Solberg Technical Consulting
Flex circuits typically replace the common hard-wire interface between electronic assemblies. Flexible circuits, however, have significant advantages over the hard-wired alternative because they fit only one way, eliminate wire routing errors, and save up to 75% on space and weight. The design guidelines for flexible circuits, although similar to rigid circuits, are somewhat unique. In essence, flex circuits furnish unlimited freedom of packaging geometry, while retaining the precision density and repeatability of printed circuits. Because the flex-circuit conductor patterns can maintain uniform electrical characteristics, they contribute to controlling noise, crosstalk, and impedance. Flex circuits will often be designed to replace complex wire harness assemblies and connectors to further improve product reliability. During the half-day tutorial program, participants will have an opportunity to review and discuss the latest revision of IPC- 2222 and IPC-2223, “Sectional Design Standard for Flexible Printed Boards,” that includes base material sets, alternative fabrication methodologies and SMT-on- flex assembly processes. The workshop will also furnish practical flex circuit supplier DfM recommendations for ensuring quality, reliability and manufacturing efficiency. Topics of discussion: 1. Applications and use environment (commercial/consumer, industrial/automotive, medical/aerospace); establishing end-use criteria 2. Designing flexible and rigid-flex circuits (flex circuit outline planning; circuit routing and interconnect methodologies; fold and bend requirements; SMT land pattern reinforcement criteria). 3. Material and SMT components (IPC standards for flex and rigid-flex dielectrics; base material and metallization technologies; selection criteria for SMT components; SMT land pattern development). 4. Assembly processing of flex and rigid-flex circuits (dimensioning and tolerance criteria; palletized layout for inline assembly processing; SMT assembly process variations and methodologies, alternative joining methods for flexible circuits).
Who should attend: PCB Designer/Design Engineer, System Designer, Fabricator Engineer/Operator, Assembly Engineer/Operator Target audience: Beginner, Intermediate
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