Page 12 - PCB-West-2020-Catalog

OVERVIEW OF PCB WEST 2020 TECHNICAL CONFERENCE BY SUBJECT
£Beginner £ Intermediate £Advanced
COMPONENTS/PACKAGING - CONT.
Semi-Additive PCB Processing Resets the Technology Curve
Mike Vinson, Averatek, and Kelly Dack, KeyTronic
£££
Next-Generation Materials: High-Speed, RF and HDI Designs
Michael R. Creeden, CID+, Insulectro
£££
Place and Route for Dense High-Speed and RF Circuits
Michael R. Creeden, CID+, Insulectro
£££
PCB Problem Solving – PCB 102
Paul Cooke, AGC-Nelco Taconic
££
DESIGN SOFTWARE
A Practical Guide to RF and Microwave PCB Design
Benjamin Jordan, Altium
££
Bringing Electronics Innovations to Market Faster with a Software- Based PCBA Manufacturing Model
Dan Radler, Tempo Automation
£
From Smart Factory Automation to Digital Twin Standard: Ushering a New Era for Design and Manufacturing
Michael Ford, Aegis Software, and Hemant Shah, Cadence
£££
Accelerate PCB Platforms Layout Design Using AI Smart Router
Naveid Rahmatullah, Intel, and Xiao Ming Gao, Intel
£££
The Current State of Fabrication and Assembly – Dispelling Myths, Correcting Misunderstandings, and Explaining Mysteries
Shane Shuffield, Advanced Assembly, and Mark Hughes, Advanced Assembly
££
Fundamentals of Geometric Dimensioning and Tolerancing (GD&T) for the PWB Designer
Gary Ferrari, FTG
££
DFF/DFM/DFA/DFT
Power Delivery System Design
Lee Ritchey, Speeding Edge
£££
A Practical Guide to RF and Microwave PCB Design
Benjamin Jordan, Altium
££
PCB Design and Assembly Process Strategy for High Density CSP, WLP, 2D and 3D Semiconductor Package Technology
Vern Solberg, Solberg Technical Consulting
£££
IoT PC Board Design and Layout
Rick Hartley, RHartley Enterprises
££
PC Board Design of Power Distribution and Decoupling
Rick Hartley, RHartley Enterprises
££
The PCB Design Process from Cradle to Grave
Daniel J. Smith, Raytheon SAS
££
Flexible and Rigid Flex Circuits: Design, Fabrication and Assembly Process Principles
Vern Solberg, Solberg Technical Consulting
££
Fundamentals of Geometric Dimensioning and Tolerancing (GD&T) for the PWB Designer
Gary Ferrari, FTG
££
Design and Implementation of Copper Coin Application Over Thermal VIA (Vertical Interconnect Access) Structure for Thermal Management up to 12W Device Application
Marcus Miguel V. Vicedo, Analog Devices, and Richard Legaspino, Analog Devices
£
The Current State of Fabrication and Assembly – Dispelling Myths, Correcting Misunderstandings, and Explaining Mysteries
Shane Shuffield, Advanced Assembly, and Mark Hughes, Advanced Assembly
££
Design-for-Manufacture and Design-for-Assembly Fundamentals that Decrease Holds and Lower the Cost of Manufacturing
Mark J. Hughes, Royal Circuit Solutions, and Elijah Gracia, Royal Circuit Solutions
££
From Smart Factory Automation to Digital Twin Standard: Ushering a New Era for Design and Manufacturing
Michael Ford, Aegis Software, and Hemant Shah, Cadence
£££
Next-Generation Materials: High-Speed, RF and HDI Designs
Michael R. Creeden, CID+, Insulectro
£££
Place and Route for Dense High-Speed and RF Circuits
Michael R. Creeden, CID+, Insulectro
£££
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